Functional Materials Business

In our Functional Materials Business, we provide materials with various functions, such as epoxy resins that serve as an insulating material for semiconductor encapsulation, UV-curable resins used in various fields such as color resists, solder masks and hard coatings, and maleimide resins, with high heat resistance and low transmission loss, used in circuit boards for “5G” next generation mobile communication systems.

In addition, we also develop high value added products for use in a wide range of fields. These products include formulated resin composites such as Sealants for LCD, Sealants for LED, Photoresists and Insulating materials for micro electro mechanical systems (MEMS) that combine our proprietary resins with structuring technologies. In addition, we also offer a line-up of cleaning agents and chemicals (developing solutions, bulk removers and residue removers) used for producing LCD panels (color filters) and semiconductors.

Main Products

Epoxy Resins, Maleimide Resins, Acrylate Resins

Epoxy Resins

Nippon Kayaku manufactures and develops various high-purity epoxy resins for high demanding markets such as the electrical and electronic fields, in which a high degree of electrical reliability is required. In particular, we develop epoxy resins in line with the technological trends focused on products around semiconductor packages (e.g., epoxy resins for semiconductor encapsulation and substrates).
Our line-up consists of Novolac type epoxy resins with special features and properties that derive from their unique structures.

Representative Epoxy Resin: NC-3000

We have prepared the NC-3000 series as lead-free solder compatible and halogen-free flame-retardant compatible environmentally-friendly type epoxy resins for electronic materials. The materials hardened using these epoxy resins possess high thermal stability and advanced toughness. In addition, they have environmentally-friendly type characteristics which can support advanced flame retardance and the reflow temperature of lead-free solder without being reliant on halogen-based flame retardants that have a heavy environmental burden. Furthermore, these epoxy resins have also been considered for various applications in recent years. These include 5G-related materials from their low dielectric characteristics and composite materials from their flame retardance and advanced toughness.

Maleimide Resins

There is a need to realize the characteristic of a low dielectric loss tangent to ensure there is no delay in communication signals to resins for electronic parts. This is due to the miniaturization and improvement in functionality of electronic equipment and the increase in speed and capacity of communications in recent years. In particular, there is an increasing market need for low dielectric loss tangent materials required for an increase in the speed and capacity of communications – from smartphones and other devices to severs that control and manage information. This is to support the fifth-generation telecommunications standard 5G that is expanding and also the future beyond that. We have developed and industrialized new maleimide resins to meet these market needs. Unlike existing maleimide compounds, our maleimide resins are highly soluble in solvents and demonstrate strong toughness even after hardening. They are materials that realize a low dielectric loss tangent while satisfying the requirements of resins for electronic materials that demonstrate high flame retardance.


Acrylate Resins

Nippon Kayaku has a lineup of various unique characteristic-possessing acrylate monomers and epoxy acrylates, urethane acrylates and other acrylate oligomers as the KAYARAD Series of UV-curable resins. In particular, the series has a strong track record of achievements because we excel in technology that gives contradictory flexibility to polyfunctional acrylates with excellent hardening properties. In addition, we also handle the special methacrylate "KAYAMER series" that improves the adhesion performance to inorganic materials, the acid-modified epoxy acrylate with developability, and the "KAYACURE series" of photopolymerization initiators and sensitizers. These are suitable as materials for various coating agents, adhesives and molded products.


Resist for MEMS

SU-8 3000CF Dry Film Resist (DFR) is a negative type permanent film photoresist that can produce rectangular shapes with a high aspect ratio through the photolithography process. It has a structure in which the resist layer is laminated with a cover film and a support film. This eliminates the solvent removal processes and contributes to process simplification. SU-8 3000CF DRF is suitable for forming hollow structures (cavity structures) and is widely used in electronic device applications.


We engage in the development, manufacture and marketing of chemicals used in each manufacturing process for high resolution and high performance displays, semiconductors and electronic components markets. Harnessing our capabilities in proprietary development, we have established a product lineup with excellent performance that is unrivaled by peers. This product lineup contributes to the development of the entire electronics industry.

Technical Documents

You can download technical information on thermosetting resins and UV-curable resins. Please ask directly for more detailed information.

Functional Materials Division

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