SU-8 DFR Series
Epoxy-Based Photoresists for High-Aspect-Ratio Structures
The SU-8 Dry Film (DFR) Series is a family of negative-tone dry film photoresists based on photosensitive epoxy resins designed for permanent structures.
These materials use low-halogen epoxy resins and do not contain antimony.
They are used to form chemically and thermally stable structures, such as walls and caps (roofs) for cavity packages, and lids for microfluidic channels.
SU-8 3000CF DFR
Key Features of SU-8 3000CF DFR
SU-8 3000CF DFR is a negative-tone, epoxy-based dry film photoresist that can be patterned using UV light.
It offers performance suitable for semiconductor manufacturing and MEMS devices.
- ● High-definition patterning: negative-tone photoresist compatible with photolithography
- ● Low-halogen formulation: total chlorine content below 900 ppm; designed as an antimony-free material
- ● High resolution and high aspect ratio: vertical sidewalls with an aspect ratio of 3 or higher at a 20 μm film thickness
- ● Excellent heat resistance: stable under high-temperature conditions
- ● Low-temperature processing: hard bake at 180°C for 1 hour
- ● Solvent development: compatible with solvent developers; PGMEA is recommended
These properties make SU-8 3000CF DFR suitable for applications that require high precision and durability, including MEMS,
SAW/BAW filters, and semiconductor packaging.
Product Formats
Film Structure
Appearance
※Images are for illustrative purposes only.
Product Specifications
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| SU-8 3000CF DFR | |
|---|---|
| Resist Layer Thickness | 20 μm, 30 μm, 45 μm (other thicknesses available upon request) |
| Resist Width | 244mm |
| Core Width | 270mm |
| Roll Length | 25m |
| Shelf Life | 9 months |
| Recommended Storage Conditions | Refrigerated at 15°C or below |
SU-8 3000CF DFR Product Features
High-Precision Lithography Performance
SU-8 3000CF DFR is a chemically amplified, negative-tone photoresist designed for i-line (365 nm) exposure.
- ● High UV transmittance enables the formation of thick structures over 100 μm
- ● Stable pattern profiles with vertical sidewalls
- ● Accurate pattern formation with no loss of film thickness from development or curing shrinkage
Cavity Structure Formation and Thick-Film Capability
SU-8 3000CF DFR is a semi-solid, sheet-type photoresist that can be laminated at room temperature.
- ● Can be laminated without filling underlying cavities
- ● Enables easy formation of complex or cavity structures that are difficult to achieve with liquid resists
- ● Supports thick-film fabrication through multilayer DFR lamination, which is challenging with liquid resists
Typical Applications: SAW/BAW filters, structures on TSV/TGV substrates, and MEMS devices.
For cavity structure formation, optimizing both DFR properties and laminator conditions is essential.
Nippon Kayaku collaborates with its group company, Teikoku Taping System, to offer process solutions tailored to customer needs.
Major Film Properties (Reference Values)
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| Properties | Unit | SU-8 3000CF DFR |
|---|---|---|
| Glass transition temperature (Tg) (DMA) | ℃ | 248 |
| Heat resistance (5% weight loss temperature in air) | ℃ | 346 |
| Adhesion strength (shear strength on Si, 20 μm film thickness) | MPa | 40 |
| Tensile strength (25°C) | MPa | 84 |
| Young’s modulus (25°C) | GPa | 2.7 |
| Storage modulus (30°C, DMA) | GPa | 3.0 |
| Storage modulus (175°C, DMA) | GPa | 1.5 |
| Water absorption (85°C / 85% RH, 24 hr) | % | 0.4 |