SU-8 DFR Series
The SU-8 DFR Series is an epoxy-based dry film resist designed for forming high-aspect-ratio structures.
Core Technologies
What Is a Photoresist?
A photoresist is a photosensitive material used in semiconductor and printed circuit board manufacturing. When exposed to light—typically ultraviolet—it undergoes a chemical reaction that changes its properties. This reaction allows the material to function as a mask for transferring fine patterns onto a substrate.
Photoresists are classified into two types:
- Positive resists, in which the exposed areas dissolve during development
- Negative resists, in which the exposed areas harden
Dry Film Resists (DFR)
(Film type resists laminated onto the wafer)
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Liquid Photoresists
(Liquid photoresists coated onto the wafer by spin coating)
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Dry Film Resists (DFR)
Dry film resists are photosensitive materials that enable easy fabrication of cavity structures and other 3D patterns. They are well-suited for applications such as SAW/BAW RF filters that require precise, three-dimensional patterning. After lamination, the film behaves similarly to liquid photoresists and can be removed with standard solvents. This enables high-aspect-ratio, high-resolution patterning. Dry films also eliminate the need for edge-bead removal and provide uniform thickness, helping streamline the manufacturing process.
KPM DFR Series
The KPM DFR Series is a dry film resist that enables both structure formation and substrate bonding with a single material.
Benefits of Dry Film Resists (DFR)
Permanent dry film resists (DFR) allow uniform film thickness to be formed easily, enabling high-precision processing of fine patterns. They are also easy to handle and do not require waste-liquid disposal, which helps reduce environmental impact and lower operating costs.
Benefit 01
Ultra-Thick Films and High Aspect Ratio Processing
- Enables the formation of fine structures, including 360 μm-thick films and 30 μm-diameter features.
- Multiple lamination steps allow the easy formation of Ultra-Thick films.
- Prebake times can be significantly reduced.
Benefit 02
Uniform Coating for Via Filling and Complex Shapes
- When processed using a vacuum laminator, dry film resists can fill vias without voids and provide uniform coating over complex geometries.
Benefit 03
Efficient Formation of Cavity Structures
- By laminating dry film resists as wall layers, very thin polymer cavity structures can be formed with ease.
Epoxy Resin Technology for Dry Film Resists
We design and manufacture our own epoxy resins optimized for use in photoresists, and these resins are incorporated into our dry film resists. The epoxy resins feature high purity and excellent electrical insulation properties. Their low-chlorine, low-halogen design helps prevent metal corrosion and insulation degradation. These resins provide both environmental compatibility and high reliability, making them suitable for manufacturing electronic components such as printed circuit boards and semiconductor devices. They also deliver high resolution and reliability in fine-pattern formation.
Dry Film Resist Lamination Technology
- By laminating our SU-8 dry film resist (DFR), which can be used as a permanent layer, onto a wafer, cavity structures can be fabricated.
- The resulting cavity structures can be utilized as permanent membrane structures on devices.
- In addition, by using laminators manufactured by Teikoku Taping System (TTS), a Nippon Kayaku Group company, a wide range of cavity widths can be formed with high stability.
- TTS laminators are equipped with patented Digital Bumper Technologies, enabling high-quality lamination with both uniformity and reliability.
- The combination of SU-8 DFR and TTS laminators enables fine, high-precision structures and supports mass-production-level manufacturing for a variety of electronic devices.
Achieving High-Precision Cavity Structures with Patented Technology
By laminating our SU-8 dry film resist (DFR) onto wafers using laminators manufactured by Teikoku Taping System (TTS), a Nippon Kayaku Group company, high-precision cavity structures can be formed. These cavity structures can serve as permanent structural layers in device fabrication. TTS laminators are equipped with patented Digital Bumper Technologies, which enable structure formation with both uniformity and reliability. The combination of SU-8 DFR and TTS laminators provides high-quality lamination suitable for next-generation electronic device manufacturing.
Patented Technology Enables Mass-Production Fabrication of Complex Structures
Patented “Digital Bumper Technologies” by Teikoku Taping System
“Digital Bumper Technologies” uses elastic bumpers placed inside the laminator to optimally distribute pressure.
This design:
- Prevents cavity structures from being crushed
- Ensures uniform lamination
As a result, it helps prevent defects that can occur during lamination, such as uneven pressure, lifting or wrinkling of dry film resists, and bubble formation.
Liquid Photoresists
Liquid photoresists are photosensitive materials that enable the formation of fine patterns in the manufacturing of semiconductors and electronic components. Their liquid form allows uniform application by spin coating, enabling complex shapes and high‑precision patterning. They also provide easy control over film thickness, offering flexibility for a wide range of applications. As a result, liquid photoresists are essential materials in the production of high‑performance devices, including smartphones.
