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With the adoption of higher frequencies in electronic devices (5G and 5G+), new material developments are needed to meet the growing challenges of this market.
At Nippon Kayaku we have developed low dielectric loss tangent maleimide resins, achieving the technical demands for communication networks today and the future.
Unlike existing maleimide, or bis-maleimide (BMI) compounds, our maleimide resins are highly soluble in solvents whilst demonstrating strong toughness and have excellent electrical reliability. Whilst incorporating high flame retardance.